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WLCSPisatruechip-scalepackaging(CSP)technology,sincetheresultingpackageisofthesamesizeofthedieasshowninFigure1.WLCSPtechnology ...
晶粒尺寸封裝(CSP：ChipScalePackage)又稱為「裸晶封裝(Barepackage)」，其實這應該算是一種對於封裝的定義，而不是一種封裝技術，我們定義封裝後體積只有晶片 ...
ChipScalePackage(CSP,engl.;zudeutschGehäuseinderGrößenordnungdesDie)isteinChipgehäusevonintegriertenSchaltungen,beidemdasGehäuse ...
Thesearecalledchip-scalepackages(CSP)andaredefinedaspackagesthatarenolargerthan1.5timestheareaofthedieornomorethan1.2timesthewidth ...
2.Young,J.,“MicroSMTPackaging,”atechnicalpaperbyChipScale,Inc.,.Sept.1996.3.Kasai,J.,“LowCostChipScale.PackageforMemoryProducts,”SMI.
Achipscalepackageorchip-scalepackage(CSP)isatypeofintegratedcircuitpackage.Originally,CSPwastheacronymforchip-sizepackaging.Sinceonlyafewpackagesarechipsize,themeaningoftheacronymwasadaptedtochip-...
ChipScalePackage,orCSP,basedonIPC/JEDECJ-STD-012definition,isasingle-die,directsurfacemountablepackagewithanareaofnomorethan1.2X ...
FCCSP(FlipChipChipScalePackage)offerschipscalecapacityforI/Osaround200orless.FCCSPprovidesbetterprotectionforchipandbettersolder ...
SincetheintroductionofChipScalePackages(CSP's)onlyafewshortyearsago,theyhavebecomeoneofthebiggestpackagingtrendsinrecenthistory.
Thetermchip-scalepackagedescribesawafer-levelpackageddiewithsphericalbumpslocatedonagridwithapredefinedpitch.Figure3illustratesthese ...