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Copperpillarbump(CPB)technologyistoproduceabumponthesurfaceofFlipchippackagewhichhastheelectricandheatconductivityandtheresistance ...

Features·Availablewafersize:12inches(300mm)·Cleanprocessprovidedbyfluxlessreflowtechnology·Low-alpha-raySn-Agsolderplatingissupported ...

CopperpillarbumpiswidelyusedformanytypesofflipchipinterconnectwhichoffersadvantagesinmanydesignswhilemeetingcurrentandfutureROHS ...

CopperpillarbumpiswidelyusedformanytypesofflipchipinterconnectwhichoffersadvantagesinmanydesignswhilemeetingcurrentandfutureROHS ...

ThetypicalbumpstructureofCupillarbumpisasbelow;bumpUBMwassputteredonPSV(SiNorPI)andCupostwithsoldertipformedbyplatingprocess.

Cu-pillarbumpingisanext-generationflipchipinterconnectionbetweenchip&packages(FCBGA/FCCSP),especiallyforfinepitchapplications.

Cu-pillarbumpingisanext-generationflipchipinterconnectionbetweenchip&packages(FCBGA/FCCSP),especiallyforfinepitchapplications.

32/32.Pillarbump:70umCopper+30umSn63/Pb37solder.Package:6x6mmTFBGA(molded/48ball).結語.現有的凸塊及組裝技術，應用於微間距覆晶技術時，仍有 ...

Cu-pillarbumpingisanext-generationflipchipinterconnectionbetweenchip&packages(FCBGA/FCCSP),especiallyforfinepitchapplications.

銅柱凸塊的精細凸塊間距可以達到小至50微米，因此提高了Flipchip在載板及模組的封裝能力。而無鉛凸塊（SnAg1.8％）則可以滿足RoHS和綠色產品要求。